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Selecting UV-curing adhesives, coatings and potting compounds

UV-curing adhesives, coatings and potting compounds combine short process times with a cure that can be controlled deliberately. Which material class fits, however, does not depend on the available UV wavelength alone. Substrate transmission, layer thickness, pigmentation, filler content, oxygen contact and shadowed areas decide whether a free-radical, cationic or dual-curing system is suitable. The selection aid below sorts the material classes by application, process limits and the post-cure they require.

The curing reaction itself is covered on the fundamentals page on how UV curing and photopolymerization work; how to lay out a bonding or potting process in the joint is shown under designing UV bonding and potting processes.

What the curing mechanism contributes to material selection

In UV curing, radiation activates a photoinitiator and starts the cross-linking of the material. A detailed account of reaction pathways, irradiance and dose is given on the specialist page on reaction pathways, irradiance and dose in UV curing.

For material selection, what matters here is above all the chemistry, the optical properties and the accessibility of the entire reaction zone.

Material systems compared

Two levels of distinction matter when choosing a material: the chemistry of the binder system – free-radical versus cationic – and the decision between single-cure and dual-cure systems for geometrically demanding parts.

TechnologyCharacteristicsAdvantagesLimitationsTypical application
Free-radical photopolymerization (acrylates, methacrylates)Chain growth across C=C double bonds, started by type I or type II photoinitiators (e.g. TPO, benzil dimethyl ketal)Curing within seconds, broad raw material base, high initial strengthSurface cure inhibited by oxygen, no appreciable dark cure, linear shrinkage of 1–2 %Bonding, potting and coating of glass, metal and plastics in electronics and optics
Cationic photopolymerization (cycloaliphatic epoxies)A photoacid generator (onium salt) opens the epoxy rings; chain reaction of protonation, ring opening, chain transfer and terminationNo oxygen inhibition, post-cure in the dark possible („shadow cure“), lower shrinkage, good adhesionSensitive to humidity, usually needs shorter-wavelength excitation, slower strength build-up than acrylatesEncapsulation of optoelectronic and electronic components, moisture-stable potting
Single-cure systemCures exclusively by UV lightSimple process, short cycle timeNo cure in shadowed areas, depends on a direct line of sight to the light sourceParts without undercuts, bond lines that can be fully illuminated
Dual-cure system (UV plus moisture, heat or anaerobic)Primary cure by UV, secondary mechanism for unexposed areasCures in cavities and undercuts as wellAdditional process step or post-cure time, more complex formulationSensor potting, connectors, parts with undercuts

On the radiation source, a note is enough here: mercury vapour lamps emit broadband, UV LEDs narrowband at discrete peaks (365, 385, 395 and 405 nm). All that matters for material selection is whether the absorption band of the photoinitiator in use is actually hit. The sources themselves are compared on the technology page on UV LEDs for UVA, UVB and UVC.

Selection matrix: requirement, material system and critical limit

The matrix assigns each typical requirement the material system to examine first and the limit at which that system fails.

RequirementExamine firstCritical limit
Fast surface cureFree-radical system (acrylate, methacrylate)Oxygen inhibition at the surface
Low shrinkage or dark areasCationic or dual-cure systemPost-reaction and material compatibility
Thick or filled layerFormulation with high transmission in the initiator's absorption rangeAbsorption and scattering by pigments and fillers
Concealed bond areaDual cure or secondary curing mechanismShadowed zones that receive no radiation
Transparent coatingSpectral match and surface processYellowing and over-exposure

Whether the chosen source actually delivers the radiation needed at the part is only shown by a measurement: which sensor measures which quantity reliably is covered under selecting suitable UV sensors; why two instruments can show different readings at the same source is explained under spectral mismatch.

Common misconceptions in material selection

A handful of assumptions come up again and again in material selection and can lead to incomplete cure or to customer complaints. The general misconceptions about lamp power, dose and reciprocity are covered on the fundamentals page on the limits of dose and the reciprocity law:

  • „Oxygen inhibition affects the whole volume“: dissolved oxygen in the bulk is consumed quickly under irradiation; the real problem is the continuously re-diffusing oxygen layer at the surface, which leaves tacky, uncured surfaces especially at low irradiance.
  • „An acrylate formulated for 365 nm cures tack-free with any 365 nm LED“: for a tack-free surface, several common acrylate adhesive systems need additional radiation in the 220–260 nm range to overcome oxygen inhibition – a requirement that LED systems emitting only at 365 nm cannot meet, and one that has to be taken into account when selecting the formulation.
  • „A line of sight between lamp and bond line is optional“: in areas shadowed by UV-opaque parts (metals, ceramics, filled plastics) a pure UV material stays liquid, even when directly illuminated areas next to it are fully cured.

Source ageing adds to this: irradiance and spectrum shift over operating time, so a released process window has to be re-measured regularly – see ageing of UV lamps and UV LEDs.

Material effects: fillers, pigments and layer thickness

Filled or pigmented formulations behave fundamentally differently from clear systems. Opaque pigments such as carbon black or titanium dioxide absorb part of the UV radiation the photoinitiator needs before it reaches deeper layers; inorganic fillers such as glass beads or silica additionally scatter the light and reduce the intensity with depth exponentially.

The result is a cure gradient in which material near the surface cures completely while the core stays liquid. The Lambert-Beer law describes this quantitatively through the penetration depth Dp, at which the intensity has fallen to 1/e of its value, and the critical energy Ec needed as a minimum to initiate polymerization.

For pigmented systems it is worth moving to longer wavelengths (385 or 405 nm instead of 365 nm), because many pigments scatter and absorb these less strongly. Simply raising the dose helps only up to a point: it can over-cross-link and yellow the near-surface region without improving the cure in the core. Layer thickness also affects the shrinkage stress that builds up during cure: typical values are 1–2 % linear and 2–5 % volumetric shrinkage, which in thicker layers acts three-dimensionally and can impose mechanical stress on adjacent components when the cure is faster than the stresses can relax.

For geometrically demanding parts with undercuts or UV-opaque materials (metals, ceramics, filled plastics), dual-cure systems have become established. They combine a UV primary cure with a secondary mechanism: UV plus moisture cure for shadowed areas without additional heat input, UV plus thermal post-cure for highly loaded bonds, and UV plus anaerobic cure for inactive substrates.

Cationic epoxy systems offer an alternative rooted in the chemistry itself: after the exposure ends, their onium salt photoinitiators continue an acid-catalysed dark reaction and can therefore reach shadowed areas without a second curing mechanism – at the cost of lower initial strength and higher moisture sensitivity than acrylates. For applications with no line of sight at all between light source and bond line, research is also looking experimentally at non-optical excitation such as X-rays, which does not require a direct line of sight; that approach is at the research stage and not in broad industrial use.

Current material trends

  • Wavelength shift from 365 nm towards 385, 395 and 405 nm: UV LEDs reach a higher wall-plug efficiency at longer wavelengths, but this calls for reformulated photoinitiator systems matched to the wavelength, because classic initiators developed for mercury lamps can lose efficiency at 405 nm.
  • More dual-cure formulations: new product lines combine UV with moisture cure in order to reach shadowed areas without additional heat input; the technical consequence is an additional, time-separated post-cure step in production planning.
  • Photoinitiators without a critical classification: in response to the REACH classification of TPO, alternative aliphatic multi-functional initiators with lower cytotoxicity are being developed, which means existing formulations have to be re-assessed for cure behaviour and absorption whenever a raw material changes.
  • Miniaturization in electronics and optics: smaller part geometries with tighter cavities increase the need for dual-cure systems and precise dose control, because flood curing reaches its geometric limits.

How the irradiance and UV dose this requires are captured at the part is covered by the product overview of UV measuring instruments and radiometers.

Selection guide: narrowing down a material system

Selection starts with the question of which wavelength actually reaches the adhesive in the bond line – determined by substrate transmission, shadowed areas and the spectral match between lamp and photoinitiator – and derives from that whether a single-cure acrylate is sufficient or whether a dual-cure or cationic system is needed for unexposed zones. Only once application, technical problem, measurand and process quantity and the suitable technology have been clarified does a concrete product selection become meaningful.

What spectrum the existing source really delivers only shows in a measurement at the part; measured spectra of common lamp types are available for comparison in the spectral database for UV lamps.

Market overview and product selection

The following selection is a referenced compilation of commercially available products based on publicly accessible manufacturer data sheets. It does not claim to be complete; the figures for wavelength and chemical base are taken from the respective technical data sheets and should always be verified against the current data sheet before a process is designed. Each product name links to the manufacturer document evaluated – technical data sheet, product data sheet or product page. Opsytec does not sell adhesives, coatings or potting compounds; this overview serves technical orientation only.

UV adhesives on the market

Selection criterion: The chemical base and the absorption range of the photoinitiator have to match the available source; bond gap, substrate transmission and the required initial strength then decide between a free-radical acrylate, a cationic epoxy and a dual-cure system. Limit: In shadowed zones and behind UV-opaque joining parts a pure UV acrylate stays liquid – a secondary mechanism is needed there. Typical application: Fixturing and joining in electronics, optics, medical technology and battery assembly, where second-range cycle times and locally confined heat input are required.

ProductManufacturerChemical baseWavelength(s)Application
LOCTITE AA 3492HenkelModified acrylate, 1K365 nmBonding, potting and sealing of glass
LOCTITE AA 3494HenkelLight-curing acrylic365 nm (plus 220–260 nm for the surface)Glass and glass/metal, potting
LOCTITE AA 3211HenkelAcrylated urethane, thixotropic365 nm (plus 220–260 nm for the surface)Bonding in medical technology and electronics
LOCTITE AA 3341HenkelAcrylated urethane365 and 405 nmBonding and potting
DELO KATIOBOND GE680DELOModified epoxy, cationicLED 365 nm, UVAChip module encapsulation
DELO PHOTOBOND OC4022DELOModified acrylate, optically clear320–420 nm (400 nm optimal)Display and touch panel bonding
DYMAX 3099DymaxAcrylated urethane320–400 and 320–450 nmPlastic and glass bonding
DYMAX MD 1187-MDymaxAcrylated urethaneUVA 320–395 nm; LED 365/385 nmMedical technology
VITRALIT UV 4050 (LV)PanacolAcrylateUV-A 320–390 nm; 365 nm; 405 nmMedical technology, thermoplastics (ISO 10993-5)
VITRALIT 1605 MVPanacolEpoxyUV-A 320–390 nm; LED 365 nm (405 nm unsuitable)Electronics and optics
PERMABOND UV620PermabondMethacrylate ester365–400 nmGlass, glass/metal
PERMABOND UV6260PermabondUrethane acrylate365–420 nmTinted glass, metal/plastic
MASTER BOND UV22Master BondNanosilica-filled UV epoxy, cationic320–365 nmOptics and electronics
EPO-TEK OG198-54Epoxy TechnologyUV epoxy, „shadow curable“240–365 nmFibre optics, optical assembly
NOA 68NorlandClear photopolymerLong-wave UV; 4.5 J/cm² for full cureOptical bonding
ThreeBond TB3012DThreeBondModified urethane acrylate, UV and heatLED 365 nm; mercury lamp („D“ bulb)Potting and encapsulation, flexible
Bostik Born2Bond LC176/LC177BostikUV acrylate365–405 nmSeries production („cure on demand“)

UV coatings and conformal coatings

Selection criterion: What governs the choice is layer thickness, the required surface hardness and whether the surface has to cure tack-free – that decides between accepting oxygen inhibition, inerting the atmosphere or using a formulation designed for it. Limit: Pigmented and highly opaque coatings cure incompletely in depth; simply raising the dose causes over-cross-linking and yellowing near the surface. Typical application: Conformal coatings on printed circuit boards, furniture and component coatings on web lines, and print finishing.

ProductManufacturerChemical baseWavelength(s)Application
DYMAX Multi-Cure 9-20557Dymax100 % solids, UV and heat365 nmConformal coating and encapsulation of circuit boards (MIL-I-46058C, IPC-CC-830-B)
DYMAX 984-LVUFDymaxUV and heat, thin filmnot statedThin-film conformal coating for electronics (UL 94 V-0)
Electrolube UVCL/UVCLP/UVCLXElectrolubeUrethane acrylate, dual-cure (UV and moisture)UVA, 600–3,000 mJ/cm²Conformal coating for electronics in harsh environments
Peters ELPEGUARD UV Twin-Cure DSL 1600 E-FLZLackwerke PetersCopolymer of PU and polyacrylatenot statedThick-film conformal coating for circuit boards
ELANTAS Bectron PT 4700 NELANTASSolvent-free, light-curingnot statedConformal coating for circuit boards
KANSAI HELIOS UVEHEL parquet systemHelios TBLUS / Kansai Paint1K UV coatings, partly water-basedMedium-pressure mercury lamp, 80–120 W/cmParquet and wooden floor coating
Bona Craft UVBonaBio-based polymer, UV-curingnot statedIndustrial wooden floor coating

UV potting compounds on the market

Selection criterion: Potting height, filler content and whether radiation can reach the entire potting volume are decisive; for optoelectronic parts, refractive index and resistance to yellowing are added. Limit: As potting height and filler content grow, a cure gradient with a liquid core develops – above a few millimetres, dual-cure or cationic systems with a dark reaction are preferable. Typical application: Encapsulation of sensors, connectors and optoelectronic assemblies, moisture-stable potting.

ProductManufacturerChemical baseWavelength(s)Application
DYMAX Multi-Cure 9001-E-V3.1DymaxModified urethane, 1KLong-wave UV and visible lightEncapsulation in electronics and optics (ASTM E595)
DELO KATIOBOND 4670DELOModified epoxy, cationicUVA 320–400 nm; LED 365 nmEncapsulation of electronic components
Master Bond UV18MedMaster BondUV system for medical use320–365 nmPotting in medical technology (USP Class VI, ISO 10993-5)
Master Bond UV15-7SP4Master Bond100 % reactive, flexiblenot statedGeneral-purpose UV potting compound
EPO-TEK OG116-31Epoxy TechnologyUV optical epoxy, 1K240–365 nmEncapsulation of circuit boards and semiconductors

Frequently asked questions on UV-curing adhesives, coatings and potting compounds

How are wavelength, irradiance and dose related?
The wavelength decides whether the photoinitiator is excited at all, the irradiance sets the rate at which radicals or acid are formed, and the dose is the time integral of that irradiance. Higher irradiance does not make up for a wavelength mismatch, and a dose figure alone does not let the process be reconstructed. This is derived – including the limits of the reciprocity law – on the fundamentals page on the process variables of UV curing.

What distinguishes free-radical from cationic UV curing?
Free-radical acrylate systems cure within seconds but are oxygen-sensitive at the surface and show a linear shrinkage of 1–2 %. Cationic epoxy systems are insensitive to oxygen, continue to post-cure in the dark after exposure ends and shrink less, but they react sensitively to humidity and build initial strength more slowly.

When is a dual-cure system required?
As soon as part of the reaction zone has no direct line of sight to the radiation source – undercuts, cavities, bond areas behind metal, ceramic or filled plastics. The secondary mechanism (moisture, heat or anaerobic) cures those areas afterwards, but requires a separate post-cure step in the process plan. Cationic epoxies reach shadowed areas partly without a second mechanism through their dark reaction.

Why do UV adhesives often stay liquid in shadowed areas?
Free-radical curing systems need a direct line of sight to the light source, because activation of the photoinitiator relies on photons actually arriving. Areas behind UV-opaque parts, metals or in undercuts do not receive sufficient irradiation and do not cure unless a second curing mechanism such as moisture or heat post-cure is provided.

What role does oxygen play in UV curing?
Oxygen quenches radicals into unreactive peroxy radicals and therefore acts mainly as a surface effect, since dissolved oxygen in the bulk is consumed quickly under irradiation, while oxygen diffusing in continuously at the interface with air delays a tack-free cure. Cationic systems are unaffected by this, but are sensitive to moisture instead.

How do pigmentation and layer thickness affect the cure?
Pigments such as carbon black or titanium dioxide absorb and scatter part of the radiation before it reaches deeper layers; as the layer grows thicker this creates a cure gradient with a cured surface and a liquid core. Moving to longer wavelengths (385 or 405 nm instead of 365 nm) helps, whereas simply raising the dose does not – it causes over-cross-linking and yellowing near the surface without materially improving the cure in the core.

What irradiance does a UV adhesive require?
There is no blanket answer – what governs this is the adhesive's data sheet and the absorption range of its photoinitiator. Typical figures lie between a few tens and a few hundred mW/cm² in the matching wavelength range, together with a minimum dose.

Which standards are relevant for UV potting compounds?
For reactive resin compounds and potting systems the IEC 60455 family applies, in particular IEC 60455-2:2023 for test methods such as degree of cure and mechanical properties. In medical technology, ISO 10993 for biological evaluation and sector-specific approval standards from automotive and aerospace apply in addition, depending on where the potted part is used.

Relevant standards and market sources

  • ISO 10993-1:2018/2025 – biological evaluation of medical devices, part 1; the revised edition EN ISO 10993-1:2026 has been available since 15 January 2026.
  • IEC 60455-2:2023 – test methods for reactive resin compounds (potting compounds), 4th edition 2023.
  • ASTM D1002 / D3163-01(2023) – lap shear strength of metal and of rigid plastic adhesive joints.
  • UV-Curable Adhesives Market – Mordor Intelligence, data as of 2026; market volume and segment shares.
  • UV-Curable Coatings Market Report – Grand View Research, 2025; global market figures for UV coatings.
  • RoHS exemption 4(f)-IV – Clarifications on 2027 Expiration, UV+EB Technology, 2026; regulatory status of mercury lamps.

An overview of the regulations relevant to UV applications is given under guidelines, norms and standards in UV.

References

The following scientific publications are the primary basis for the statements made in this report on reaction kinetics, the reciprocity law and measurement methodology. For full manufacturer data sheets and standards documents, please refer to the sources cited above.

Editorial status: 2 September 2026.

Subject Matter Expert

Author: Dr. Mark Paravia

Dr.-Ing. Mark Paravia is the managing director of Opsytec Dr. Gröbel GmbH in Ettlingen and heads the accredited calibration laboratory. Following his research on pulsed xenon excimer discharges at the Institute of Lighting Technology at KIT, his current focus is on optical radiation measurement technology. He is vice-chair of the DIN Standards Committee FNL 7 “Optical Radiation,” and a member of the DVGW Project Group on UV Disinfection.

Advice on UV measurement for your curing process

Whether the released process window is still met at the source actually in use only becomes clear from a measurement at the part. We measure the spectrum, irradiance and dose of your curing process and advise on suitable measurement technology – from the flat UVpad spectroradiometer that travels through the machine, through the RMD Pro radiometer and the XT series UV curing sensors for process monitoring, to UV irradiation chambers for reproducible curing trials in the laboratory. Send us your question.